Apparecchiature per lo stampaggio dei semiconduttori
(25)
Sistema di raffreddamento ad acqua Equipaggiamento di lavorazione dei semiconduttori Sistema di stampaggio dei semiconduttori Alta pressione
Prezzo: Negotiable
MOQ: 1 set
Tempo di consegna: 40 days
Marca: TJIN
Evidenziare:Water Cooling Semiconductor Processing Equipment, Water Cooling Semicon Molding System, High Pressure Semiconductor Processing Equipment
Semicon Molding System Product Detail: Product Name: Semiconductor Molding Equipment Energy Consumption: Low Control System: PLC Application: Semiconductor Industry Molding Method: Injection Molding Capacity: High Plasticizing Press Plasticizing Press Plasticizing Press PLC Control System ● The auto... Visualizza di più
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1000 tonnellate attrezzature per lo stampaggio dei semiconduttori dispositivo di sigillamento in plastica alta precisione
Prezzo: Negotiable
MOQ: 1 set
Tempo di consegna: 40 days
Marca: TJIN
Evidenziare:1000 Tons Semiconductor Molding Equipment, Semiconductor Molding Equipment High Precision, semiconductor molding machine High Precision
Automatic Semiconductor Plastic seal Device FAQ: Q: What is the brand name of this product? A: The brand name of this product is TJIN. Q: What is the model number of this product? A: The model number of this product is 002. Q: Where is this product manufactured? A: This product is manufactured in Ch... Visualizza di più
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Apparecchiature di stampaggio a semiconduttori completamente automatiche
Prezzo: Negotiable
MOQ: 1 set
Tempo di consegna: 40 days
Marca: TJIN
Evidenziare:Fully Automatic Semiconductor Molding Equipment, Fully Automatic Semiconductor Molding machine
Fully Automatic Transfer Molding' Features ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● High efficiency cake loading component, aluminum box loading; ● Automatic cassette loading, double cassette stacked loading; ● Supports flexible expansio... Visualizza di più
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Apparecchiature di imballaggio per semiconduttori ad alta efficienza
Prezzo: Negotiable
MOQ: 1 set
Tempo di consegna: 40 days
Marca: TJIN
Evidenziare:Highly efficient Semiconductor Packaging Equipment, Highly efficient ic packaging Equipment
Semiconductor Packaging Equipment Features ● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products; ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● High efficiency cak... Visualizza di più
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Sistema di incapsulamento automatico del chip
Prezzo: Negotiable
MOQ: 1 set
Tempo di consegna: 40 days
Marca: TJIN
Evidenziare:Auto Chip Encapsulation System, Auto Chip encapsulation equipment
Auto Chip Encapsulation System Packing and Shipping: Packaging and Shipping for Semiconductor Molding Equipment Our Semiconductor Molding Equipment is carefully packaged to ensure safe delivery to our customers. Each unit is packed in a sturdy wooden crate with foam padding to protect against any da... Visualizza di più
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Fabbricazione di semiconduttori
Prezzo: Negotiable
MOQ: 1 set
Tempo di consegna: 40 days
Marca: TJIN
Evidenziare:Chip Transfer Molding semiconductor manufacturing equipment, Chip Transfer Molding semiconductor manufacturing machine, Semiconductor Manufacturing Equipment Water Cooling
Product Description: Semiconductor Molding Equipment Product Overview The Semiconductor Molding Equipment is a fully automatic molding system designed for the production of high-quality semiconductor products. This advanced equipment utilizes state-of-the-art technology and features to ensure effici... Visualizza di più
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Equipaggiamento di stampaggio dei semiconduttori affidabile
Prezzo: Negotiable
MOQ: 1 set
Tempo di consegna: 40 days
Marca: TJIN
Evidenziare:Reliable Semiconductor Molding Equipment, Reliable semiconductor molding machine, PLC Controlled Semiconductor Molding Equipment
TJIN Semiconductor Molding Equipment Product Description: Semiconductor Molding Equipment Product Overview The Semiconductor Molding Equipment is a fully automatic molding system designed for the production of high-quality semiconductor products. This advanced equipment utilizes state-of-the-art tec... Visualizza di più
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Apparecchiature di imballaggio per semiconduttori ad alta produttività
Prezzo: Negotiable
MOQ: 1 set
Tempo di consegna: 40 days
Marca: TJIN
Evidenziare:High Productivity Semiconductor Packaging Equipment, High Productivity Chip Molding Device
Chip Molding Device 【Performance Parameters】 ● Model pressure: 98-1764kn; ● injection molding pressure: 4.9-29.4kn can be adjusted; ● Applicable lead frame/substrate size: 20-90mm wide, 124-300mm long; ● Applicable plastic seal size: diameter φ 11 ~ 20mm, length 12 ~ 35mm; Semiconductor plastic seal... Visualizza di più
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Strumentazione per lo stampaggio dei semiconduttori a risparmio energetico
Prezzo: Negotiable
MOQ: 1 set
Tempo di consegna: 40 days
Marca: TJIN
Evidenziare:Energy Saving Semiconductor Molding Equipment, Energy Saving semiconductor molding machine, Semicon Transfer Molding Equipment
Auto Semicon Transfer Molding Product Description: Semiconductor Molding Equipment Product Overview The Semiconductor Molding Equipment is a fully automatic molding system designed for the production of high-quality semiconductor products. This advanced equipment utilizes state-of-the-art technology... Visualizza di più
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Industria dei semiconduttori IC attrezzature di imballaggio sistema di stampaggio di chip automatizzato
Prezzo: Negotiable
MOQ: 1 set
Tempo di consegna: 40 days
Marca: TJIN
Evidenziare:Semiconductor Industry IC Packaging Equipment, Semiconductor Industry Chip Molding System, IC Packaging Equipment Automated
Chip Molding System Semiconductor packaging equipment is mainly used in TO, SOP, SSOP, TSSOP, DIP, SOT, ESOT, SOD, QFN, SMA, SMC, SMBF, MBF, JA, QFP, IPM, BGAPDFNOFP and other semiconductor devices, IC , Chip one -stop automatic packaging test. Product Description: Semiconductor Molding Equipment Th... Visualizza di più
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Equipaggiamento di stampaggio per semiconduttori ad alta efficienza Sistema di stampaggio a chip 50/60Hz
Prezzo: Negotiable
MOQ: 1 set
Tempo di consegna: 40 days
Marca: TJIN
Evidenziare:High Efficient Semiconductor Molding Equipment, High Efficient Chip Molding System, Semiconductor Molding Equipment 60Hz
Semiconductor Chip Molding System 【Features】 ● Semiconductor packaging equipment is also known as chip packaging equipment and IC packaging equipment, semiconductor MOLDING packaging equipment; ● Automatic packaging test chip, semiconductor device, IC and other products; ● Full servo control system,... Visualizza di più
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Macchina di stampaggio a semiconduttore a singola iniezione
Prezzo: Negotiable
MOQ: 1 set
Tempo di consegna: 40 days
Marca: TJIN
Evidenziare:Single Injection semiconductor molding machine, Single Injection semiconductor fab equipment, Semiconductor Molding Machine Fully Automatic
Fully Automatic Transfer Molding 【Performance Parameters】 ● Model pressure: 98-1764kn; ● injection molding pressure: 4.9-29.4kn can be adjusted; ● Applicable lead frame/substrate size: 20-90mm wide, 124-300mm long; ● Applicable plastic seal size: diameter φ 11 ~ 20mm, length 12 ~ 35mm; ● Full servo ... Visualizza di più
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Apparecchiature di produzione di semiconduttori per il stampaggio ad iniezione
Prezzo: Negotiable
MOQ: 1 set
Tempo di consegna: 40 days
Marca: TJIN
Evidenziare:Full Auto Semiconductor Production Equipment, Injection Molding Semiconductor Production Equipment, Injection Molding semiconductor fab equipment
Automatic Molding System Product Description: Semiconductor Molding Equipment Our Semiconductor Molding Equipment is designed specifically for the semiconductor industry and offers a fully automatic molding system with advanced control capabilities. With our state-of-the-art PLC control system, our ... Visualizza di più
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Apparecchiatura per lo stampaggio dei semiconduttori da 90 kW Dispositivo per lo stampaggio dei semiconduttori da trasferimento
Prezzo: Negotiable
MOQ: 1 set
Tempo di consegna: 40 days
Marca: TJIN
Evidenziare:90KW Semiconductor Molding Equipment, Semicon Transfer Molding Device, 90KW semiconductor molding machine
Semicon Transfer Molding 【Performance parameters】 ● Model pressure: 98-1764kn; ● injection molding pressure: 4.9-29.4kn can be adjusted; ● Applicable lead frame/substrate size: 20-90mm wide, 124-300mm in length, 0.15-1.2mm thick; ● Applicable plastic seal size: diameter φ 11 ~ 20mm, length/diameter ... Visualizza di più
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Equipaggiamento di stampaggio per semiconduttori ad alta produttività Sistema di stampaggio automatico a chip
Prezzo: Negotiable
MOQ: 1 set
Tempo di consegna: 40 days
Marca: TJIN
Evidenziare:High Productivity Semiconductor Molding Equipment, High Productivity Chip Molding System, Chip Molding Semiconductor Molding Equipment
Auto Chip Molding System Technical Parameters: Parameter Value Maintenance Easy Control System PLC Application Semiconductor Industry Capacity High Cycle Time Short Safety Features Advanced Molding Method Injection Molding Precision High Energy Consumption Low Pressure Control Precision Pressure Con... Visualizza di più
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Apparecchiature di stampaggio a semiconduttore elettrici Sistema di incapsulazione semiconica
Prezzo: Negotiable
MOQ: 1 set
Tempo di consegna: 40 days
Marca: TJIN
Evidenziare:Semiconductor Molding Equipment Semicon Encapsulation, Electric Powered Semiconductor Molding Equipment, Electric Powered semiconductor molding machine
Auto Semicon Encapsulation System Features ● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products; ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● High efficiency cak... Visualizza di più
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Sistema di incapsulazione del chip Semiconduttore Fab attrezzature efficienti dal punto di vista energetico
Prezzo: Negotiable
MOQ: 1 set
Tempo di consegna: 40 days
Marca: TJIN
Evidenziare:Chip Encapsulation semiconductor fab equipment, Semiconductor Fab Equipment Energy Efficient, Chip Encapsulation System Energy Efficient
Auto Chip Encapsulation System Technical Parameters: Attribute Value Product Type Molding Equipment Application Semiconductor Industry Precision High Control System PLC Temperature Control Precision Temperature Control Automation Fully Automated Molding Method Injection Molding Energy Consumption Lo... Visualizza di più
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Macchine per la produzione di chip per semiconduttori per la stampa di plastificazione automatica Certificate ISO9001
Prezzo: Negotiable
MOQ: 1 set
Tempo di consegna: 40 days
Marca: TJIN
Evidenziare:Auto Plasticizing Press Chip Manufacturing Machines, ISO9001 Semiconductor Chip Manufacturing Machines, ISO9001 chip manufacturing equipment
Auto Plasticizing Press Machine Product Detail: ● Full servo control system, PLC (Omron)+upper machine; ● Win10+15 -inch touch screen+touch keyboard; ● CCD image detection, feed anti -counter -anti -detection ● Standardized mold structure, convenient replacement; ● High -efficient ingredients, cakes... Visualizza di più
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Sistemi di stampaggio per la plasticazione di chip 380V 50Hz
Prezzo: Negotiable
MOQ: 1 set
Tempo di consegna: 40 days
Marca: TJIN
Evidenziare:Chip Plasticizing Press Semiconductor Molding Equipment, Chip Plasticizing Press semiconductor molding machine, Semiconductor Molding Equipment 380V
Chip Plasticizing Press Customization: TJIN Semiconductor Molding Equipment Customized Service Brand Name: TJIN Model Number: 002 Place of Origin: China Precision: High Capacity: High Maintenance: Easy Control System: PLC Safety Features: Advanced Our company, TJIN, specializes in providing customiz... Visualizza di più
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Macchine per la fabbricazione di semiconduttori ad alta automazione
Prezzo: Negotiable
MOQ: 1 set
Tempo di consegna: 40 days
Marca: TJIN
Evidenziare:highly Automation semiconductor fabrication machines, highly Automation Semicon Molding Equipment
Auto Semicon Molding Equipment Technical Parameters: Attribute Value Product Type Molding Equipment Application Semiconductor Industry Precision High Control System PLC Temperature Control Precision Temperature Control Automation Fully Automated Molding Method Injection Molding Energy Consumption Lo... Visualizza di più
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