Macchina di legatura IC
(2)
WLCSP TSV SIP QFN IC Bonding Machine Multi Chip Bonding Machine
Prezzo: Negotiable
MOQ: ≥1 pc
Tempo di consegna: 25~50 days
Marca: Suneast
Evidenziare:QFN IC Bonding Machine, Multi Chip Bonding Machine, SIP IC Bonding Machine
IC Bonding Machine The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image processing unit and architecture. IC bonder is suit able for IC... Visualizza di più
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Sinterizzazione automatica della struttura compatta Die Bonder SDB 200
Prezzo: Negotiable
MOQ: ≥1 pc
Tempo di consegna: 25~50 days
Marca: Suneast
Evidenziare:Sintering Automatic Die Bonder, Compact Die Bonder Equipment, Wafer Loading Automatic Die Bonder
Automatic Compact Structure Sintering Die Bonder SDB200 Wafer Loading Introduction: It is designed for power semiconductor IC bonding market, equipped with more powerful BONDHEAD system, which possesses functions like high precision bonding, pressure holding circuit maintaining and heating, achievin... Visualizza di più
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