Macchina di montaggio completamente automatica
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Controller di distribuzione di precisione della serie KDC/DC VCM SEMICONDUCTOR CHIP DIE BOND MEMS SOLDER PASTE DISPENSING micro dosaggio
Prezzo: $1-$10000
MOQ: 1
Tempo di consegna: 5-60 days
Marca: MingSeal
Evidenziare:220V chip mounter machine, SMT chip mounter machine, CE Certificated smt mounter machine
KDC/DC Series Precision Dispensing Controller ◆ Boost precision and efficiency in semiconductor and precision electronic component manufacturing. ◆ Fast-paced,highly-stable and ultra-fine dispensing. ◆ Rich supporting components and process solutions. ◆ Simple operation and easy maintenance KDC2500/... Visualizza di più
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Valvola a getto piezoelettrica della serie KPS2000 (aggiornata)
Prezzo: $1-$10000
MOQ: 1
Tempo di consegna: 5-60 days
Marca: MingSeal
KPS2000 Series Piezoelectric Jetting Valve (Upgraded) KPS2000 bseries piezoelectric jetting valve is a new generation of high-speed, precision and non-contact jetting system which can deal with low, medium, high and ultra-high viscosity media; configurations such as UV type, corrosion-resistant type... Visualizza di più
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PJS-100 Serie Piezoelettrica Valvola a getto Acustica Semiconduttore Ottica Automotive Elettronica Nuova batteria di energia
Prezzo: $1-$1000
MOQ: 1
Tempo di consegna: 5-60 days
Marca: MingSeal
Evidenziare:Semiconductor pick and place machine smd, pick and place machine smd Mounter, Semiconductor mounter machine in smt
PJS-100 Series Piezoelectric Jetting Valve This series of piezoelectric jetting valve is a non-contact jetting system of high speed and precision which can process low,medium,high and ultra-high viscosity fluid;according to product features,there are two valve bodies to choose from,including PJS-100... Visualizza di più
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Serie AC100 High Speed Die Bonder Comunicazione mobile QFN MEMS SIP OTHER Industria automobilistica Aiot Filp Ispezione dei chip
Prezzo: $1000-$150000
MOQ: 1
Tempo di consegna: 5-60 days
Marca: MingSeal
Evidenziare:SMD LED pick and place solder paste dispenser, LGA pick and place solder paste dispenser, LGA smd led pick and place machine
AS200 Series High Speed Die Bonder The AS200 series high- speed dispensing and bonding machine can be applied in the advanced MEMS bonding process to achieve die bonding of high-density and high-reliability, and supports versatile packages, such as QFN, SIP, LGA , BGA and FC , for a variety of diffe... Visualizza di più
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