Dimensione del pannello 310*320mm Livello del pannello QFN Bassa resistenza elettrica
Prezzo: Negotiable
MOQ: Negotiable
Tempo di consegna: Negotiable
Description: 310*320mm panel size, Chip size: 0.76*0.61mm; Package size: 2.76*1.97mm; Package thickness: 360um, Application: Power management, Process introduction: The coming wafer is bumped with Cu post (e.g., 50 micro meters), after thining and dicing of wafer, chips with bump are picked and plac... Visualizza di più
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Confezionamento a livello di pannello faccia verso il basso-EWLB Alta dissipazione del calore Alta affidabilità
Prezzo: Negotiable
MOQ: Negotiable
Tempo di consegna: Negotiable
Description: 1,Compared with traditional packaging methods (e.g., wire bond and substrate), it has the obvious characteristics of high heat dissipation (thick Cu), high reliability (short connection and strong surface adhesion), high voltage and high current (thick Cu). 2,It can be used in various a... Visualizza di più
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0.5 mm Spessore Livello del pannello Livello del pannello di imballaggio BGA/CSP Per adattatore di alimentazione
Prezzo: Negotiable
MOQ: Negotiable
Tempo di consegna: Negotiable
Marca: FZX Fanout Process and Product
Description: 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Process introduction: After the chip is picked and placed onto the temporary carrier board, the packaging process is carried out by compression molding, plasma c... Visualizza di più
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Livello del pannello Imballaggio Livello del pannello SiP Utilizzato in varie industrie
Prezzo: Negotiable
MOQ: Negotiable
Tempo di consegna: 1 month
Marca: FZX Fanout Process and Product
Description: 310*320mm panel size; Advantage:Small SiP package size,such as 6*6mm/7.5*7.5mm;low power consumption;multi-chip packages, high assembly efficiency. Technical capability: different functional dies are assembled in one system,for example, MCU, Bluetooth and some passive chips are assemble... Visualizza di più
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Dimensione del pannello 310*320mm Chip MOS sottile Silicio Basso consumo energetico
Prezzo: Negotiable
MOQ: 3000pcs
Tempo di consegna: 1 month
Marca: FZX Fanout Process and Product
Description: Multi-chip MOSFET 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Applications: Military applications, new energy vehicles, Power adapter, power amplifier, automotive electronics, etc. Competitive Advantage: 1... Visualizza di più
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LED Chip Silicio LED driver di corrente costante Chip 0.4mm * 0.555mm * 0.20mm
Prezzo: Negotiable
MOQ: 3000pcs
Tempo di consegna: 1 month
Marca: FZX Fanout Process and Product
Description: LED constant current driver chip; Chip size 0.4mm*0.555mm*0.20mm; Panel size 310*320mm; Package size 122mm*50mm; Process: Patch on the temporary carrier board, press EMC film, etching, then drill the hole, do electrode-plating. Applications: Mini-LED, lamps. Specifications: Chip size 0.... Visualizza di più
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310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip ((Silicone)
Prezzo: Negotiable
MOQ: 3000pcs
Tempo di consegna: 1 month
Marca: FZX Fanout Process and Product
Description: Chip size: 0.76*0.61; 1.43 * 1.06； Package size: 2.76*1.97; 2.58 * 2.92； Package thickness: 360um； Process introduction: After the chip is reconstructed to the temporary carrier board, the pick and placement is performed and later plastic compressive molding, followed by grinding, laser... Visualizza di più
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310*320mm Fan-Out Panel Level Packaging (FOPLP) IC Chip ((Silicone)
Prezzo: Negotiable
MOQ: 3000pcs
Tempo di consegna: 1 month
Marca: FZX Fanout Process and Product
Description: Panel size:310*320mm; Package size: 12*18*0.9mm; Package thickness: 0.9mm; Brief introduction to the process: After the temporary carrier board is attached, plastic sealing and chip reconstruction are done, the first layer of RDL is made, followed by etching +ABF pressing + laser drilli... Visualizza di più
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310*320mm Fan-Out Panel Level Packaging (FOPLP) GaN Prodotto
Prezzo: Negotiable
MOQ: 3000pcs
Tempo di consegna: 1 month
Marca: FZX Fanout Process and Product
310*320mm Panel size; DIE1 size:1.89*1.64mm; DIE2 size:0.926*0.626mm; Package size:6*7mm; Package thickness: 0.42mm; Process flow: The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the ba... Visualizza di più
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Imballaggio a livello del pannello di ventilazione (FOPLP) - Struttura del prodotto ((Face up) - Wafer Bump
Prezzo: Negotiable
MOQ: 3000pcs
Tempo di consegna: 1 month
Marca: FZX Fan-Out Panel Level Packaging
Description: Die with bump of MOS&MOS-Like package can be picked and placed onto the temporary carrier; C mold is performed after above die placement with face-up methodology. The mold grinding, PVD and plating will be made for RDL. The TMV will be made for the top/bot layer connection. The surf... Visualizza di più
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Imballaggio a livello di pannello di ventilazione (FOPLP) - Struttura del prodotto ((Face up)) - Sfera di legame del filo
Prezzo: Negotiable
MOQ: 3000pcs
Tempo di consegna: 1 month
Marca: FZX Fanout Process and Product
Description: As shown in above photo, compared with traditional packaging methods, the wire bond ball (copper or gold) can be made from wire bond process, it is similar to bump of chip, therefore, it has higher integration, high reliability, and low cost; through the FOPLP process , multiple MCU and... Visualizza di più
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Imballaggio a livello di pannello di ventilazione (FOPLP) Struttura del prodotto Imballaggio incorporato
Prezzo: Negotiable
MOQ: 3000pcs
Tempo di consegna: 1 month
Marca: FZX
Description: 1,Compared with traditional packaging methods, this advanced packaging replaces wire bond and substrate, therefore, it has demonstrated the characteristic of higher integration, high reliability, and low cost ; 2,While maintaining the original foot position design, it is much thinner an... Visualizza di più
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310*320mm Fan-Out Panel Level Packaging (FOPLP) Radiofrequenza (RF)
Prezzo: Negotiable
MOQ: 3000pcs
Tempo di consegna: 1 month
Marca: FZX Fanout Process and Product
Description: Panel size:310*320mm Package size: 7*6mm Package thickness: 0.75mm Process flow: The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the back of the plastic sealing material, t... Visualizza di più
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310*320mm Fan-Out Panel Level Packaging (FOPLP) Pacchetto per microfoni MEMS
Prezzo: Negotiable
MOQ: 3000pcs
Tempo di consegna: 1 month
Marca: FZX Fanout Process and Product
Description: Plating uniformity: ≤10%; Package size: 3*2mm; Package thickness: 0.26mm; Chip size: 0.96*0.78mm; Process type: FOPLP (310X320mm); Applications: Mobile phone, Bluetooth headset,MEMS, wearable electronics. Specifications: Package size: 3*2mm; Package thickness: 0.26mm; Chip size: 0.96*0.... Visualizza di più
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CPO/Mini/Micro LED con fan-out a livello di pannello (FOPLP) da 310*320 mm
Prezzo: Negotiable
MOQ: 3000pcs
Tempo di consegna: 1 month
Marca: FZX Fanout Process and Product
Description: LED constant current driver chip; Chip size 0.4mm*0.555mm*0.20mm; Panel size 310*320mm; Package size 122mm*50mm; Process: Patch on the temporary carrier board, press EMC film, etching, then drill the hole, do electrode-plating. Applications: Mini-LED, lamps Specifications: Chip size 0.4... Visualizza di più
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310*320mm Fan-Out Panel Level Packaging (FOPLP) Power Package
Prezzo: Negotiable
MOQ: 3000pcs
Tempo di consegna: 1 month
Marca: FZX Fanout Process and Product
Description: 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Process flow: face up encapsulation method is adopted. After a single patch, bump, plastic sealing and grinding (exposing the ball), then punch holes and electro... Visualizza di più
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elevato rapporto di aspetto TGV Capacità di fonderia per imballaggi a semiconduttori
Prezzo: Negotiable
MOQ: 10 panel
Tempo di consegna: 1 month
Marca: FZX -TGV
Description: As shown in the following table, the glass core substrate with 510mmX515mm size can be manufactured inside the manufacturing line. The glass thickness is varied from 0.3mm to 1.5mm (some can be extended to 5mm thick). The aspect ratio (diameter/ thickness of glass)can be varied from 1:1... Visualizza di più
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Alta efficienza anche se buco / buco cieco sul vetro 35um per chip GPU / CPU / AI
Prezzo: Negotiable
MOQ: 10 panel
Tempo di consegna: 1 month
Marca: FZX Fanout Process and Product
Description: As shown below photo, the blind or through holes can be made with angle controlling, the laser and acid methodology can be combined together to make customer specific holes. The glass can be coming from different suppliers, e.g., AF32/BF33 (Schott), EAGLE XG or AGC, etc. The shape of ho... Visualizza di più
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Pannello di vetro ad alta efficienza dimensione 510*515mm PVD 300mm-600mm
Prezzo: Negotiable
MOQ: 10 panel
Tempo di consegna: 1 month
Marca: FZX Fanout Process and Product
Description: The panel level PVD can be performed at both sides of the panel simultaneously. It is high efficient and time saving process. The panel sizes are varied within 300mm-600mm. Ti/Cu can be performed as the seed layers. The thickness is controlled with 0.1-2 micro meters. The uniformity in ... Visualizza di più
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Tecnologia di rivestimento a doppio lato del substrato di vetro stabile e facile da mantenere
Prezzo: Negotiable
MOQ: 10 panel
Tempo di consegna: 1 month
Marca: FZX -plating
Description: The panel plating machine is used for plating, Plating uniformity can achieve below 10%,High aspect ratio of glass through-hole plating can be performed, AR < 10 : 1 1,All pass padding Dia .: 100 μm Cu thick .: 10 μm Glass thick .: 600μm 2,Through hole plating Dia .: 50 μm Cu thick .... Visualizza di più
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