Dimensione del pannello 310*320mm Livello del pannello QFN Bassa resistenza elettrica
Prezzo: Negotiable
MOQ: Negotiable
Tempo di consegna: Negotiable
Description: 310*320mm panel size, Chip size: 0.76*0.61mm; Package size: 2.76*1.97mm; Package thickness: 360um, Application: Power management, Process introduction: The coming wafer is bumped with Cu post (e.g., 50 micro meters), after thining and dicing of wafer, chips with bump are picked and plac... Visualizza di più
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Dimensione del pannello 310*320mm Chip MOS sottile Silicio Basso consumo energetico
Prezzo: Negotiable
MOQ: 3000pcs
Tempo di consegna: 1 month
Marca: FZX Fanout Process and Product
Description: Multi-chip MOSFET 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Applications: Military applications, new energy vehicles, Power adapter, power amplifier, automotive electronics, etc. Competitive Advantage: 1... Visualizza di più
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Confezionamento a livello di pannello faccia verso il basso-EWLB Alta dissipazione del calore Alta affidabilità
Prezzo: Negotiable
MOQ: Negotiable
Tempo di consegna: Negotiable
Description: 1,Compared with traditional packaging methods (e.g., wire bond and substrate), it has the obvious characteristics of high heat dissipation (thick Cu), high reliability (short connection and strong surface adhesion), high voltage and high current (thick Cu). 2,It can be used in various a... Visualizza di più
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310*320mm Fan-Out Panel Level Packaging (FOPLP) GaN Prodotto
Prezzo: Negotiable
MOQ: 3000pcs
Tempo di consegna: 1 month
Marca: FZX Fanout Process and Product
310*320mm Panel size; DIE1 size:1.89*1.64mm; DIE2 size:0.926*0.626mm; Package size:6*7mm; Package thickness: 0.42mm; Process flow: The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the ba... Visualizza di più
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elevato rapporto di aspetto TGV Capacità di fonderia per imballaggi a semiconduttori
Prezzo: Negotiable
MOQ: 10 panel
Tempo di consegna: 1 month
Marca: FZX -TGV
Description: As shown in the following table, the glass core substrate with 510mmX515mm size can be manufactured inside the manufacturing line. The glass thickness is varied from 0.3mm to 1.5mm (some can be extended to 5mm thick). The aspect ratio (diameter/ thickness of glass)can be varied from 1:1... Visualizza di più
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Imballaggio adatto a vari esperimenti di simulazione di imballaggio
Prezzo: Negotiable
MOQ: 3000pcs
Tempo di consegna: 1 month
Marca: FZX
Description: 1. Support WBBGA, FCBGA, WLCSP, POP, FO, 2.5D and other package types of electromagnetic, thermal, structural and mode flow simulation. 2. From the electrical simulation of chip to system, SI analysis and PI analysis of package design are realized. 3. Key process feasibility simulation ... Visualizza di più
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